WaferBond ’25, the international Conference on Wafer Bonding for Microsystems, 3D- and Wafer Level Integration took place on 3rd and 4th December 2025 in Chemnitz. The event was locally chaired by Fraunhofer ENAS, technically chaired by Schmalkalden University of Applied Sciences, and organised by ErzM Technologies UG. This video, produced by Imme Ellebrecht, provides an insight into the topics covered and the atmosphere of this intensive networking event.

https://www.waferbond.de/